[Information] Q&A Collection on Semiconductor and LCD Processing ~ Resolving Questions about Aluminum Cutting Processing ~
Attention those in the semiconductor and LCD industries! [Introducing useful information for parts processing based on four points: size, thickness, material, and precision!]
In the processing of large products and vacuum chambers for semiconductor and LCD manufacturing equipment, the complexity of shapes often leads to multi-step processes. In this fast-paced industry, it is crucial to find partners who can handle everything from material and thickness selection to high-precision processing with fewer steps. The "Shinwa Q&A" document provides useful information about semiconductor and LCD component processing in an easy-to-understand Q&A format, focusing on four points: size, thickness, material, and precision. 【Questions addressed】 ◎ Can't find a processing or surface treatment company for large products...? ◎ Deformation or distortion occurred in the processed metal parts. ◎ There were scratches or defects on important parts of the material. *For more details, please request the document or view the PDF data from the download.
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